[PDF.77bc] Micromachined Devices and Components 4 (Proceedings of SPIE) (v. 4)
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Micromachined Devices and Components 4 (Proceedings of SPIE) (v. 4)
From Society of Photo Optical
[PDF.zq41] Micromachined Devices and Components 4 (Proceedings of SPIE) (v. 4)
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| #19117321 in Books | 1998-09 | Original language:English | File type: PDF | 448 pages|
An assessment of micromachined devices and components. It contains discussion of bonding and packaging, including wafer bonding with an adhesive coating, and examination of chemical and gas sensors, including acoustic-wave chemical microsensors in GaAs.
You easily download any file type for your gadget.Micromachined Devices and Components 4 (Proceedings of SPIE) (v. 4) | From Society of Photo Optical. I have read it a couple of times and even shared with my family members. Really good. Couldnt put it down.