[PDF.06fa] Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Electronic Engineering)
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Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Electronic Engineering)
John Lau
[PDF.xh51] Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Electronic Engineering)
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| #2042282 in Books | Lau John H | 2010-12-22 | Original language:English | PDF # 1 | 9.30 x1.05 x6.30l,2.00 | File type: PDF | 640 pages | Reliability of RoHS Compliant 2D and 3D IC Interconnects||0 of 0 people found the following review helpful.| An excellent book addressing 2D and 3D IC packaging with emphasis on reliabilities.|By Enboa Wu|This is an excellent reference book for students in senior level or graduate school to understand the advanced packaging related knowledge, including reliability, and a useful tool for engineers in their work on advanced packaging design and analysis. The book covers a wide spectrum|About the Author|John H. Lau, Ph.D., P.E., IEEE Fellow, ASME Fellow, ITRI Fellow, spent 30 years in the electronics industry (HP and Agilent) in Palo Alto, California, and currently serves as a fellow at the Electronics & Optoelectronics Laboratories, Ind
Proven 2D and 3D IC lead-free interconnect reliability techniques
Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging ...
You easily download any file type for your gadget.Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Electronic Engineering) | John Lau. Which are the reasons I like to read books. Great story by a great author.