[PDF.72pj] Semiconductor Packaging: A Multidisciplinary Approach (Wiley Professional)
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Semiconductor Packaging: A Multidisciplinary Approach (Wiley Professional)
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[PDF.dv59] Semiconductor Packaging: A Multidisciplinary Approach (Wiley Professional)
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| #6459537 in Books | 1997-04-01 | Original language:English | PDF # 1 | 8.94 x1.57 x5.71l,.0 | File type: PDF | 904 pages||From the Publisher|The creation of successful and reliable electronic products involves the interaction of electrical, mechanical, materials, and reliability engineering. This book covers all the physical systems, processes, and materials that a packaging engine
This practical guide covers the full spectrum of issues and problems that confront the packaging engineer and provides all the tools and information needed to overcome them.
In this book, practicing mechanical, electrical, and materials engineers, academic researchers, and graduate students will find all the essentials required to master the packaging and interconnection of microelectronic components. Providing thorough coverage of the interdisciplinary and interfunc...
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